Honor is currently developing several mobile SoCs, including the second-generation Qualcomm Snapdragon 8 Extreme Edition Mobile Platform (Snapdragon 8 Elite2/SM8850), the Qualcomm Snapdragon 8 Gen 5 Mobile Platform (SM8845), the MediaTek Dimensity 9500 processor, and the MediaTek Dimensity 8500 processor. These processors will cover Qualcomm and MediaTek's next-generation flagship, mid-range, and high-end products.
The second-generation Qualcomm Snapdragon 8 Extreme Edition Mobile Platform and MediaTek Dimensity 9500 processor are confirmed to be released around September 22nd of this year. They utilize TSMC's next-generation 3nm process and feature further optimized CPU and GPU performance. They are expected to achieve a peak AnTuTu score exceeding 4 million points, but the specific performance and gaming experience will depend on the actual optimization efforts of each manufacturer.
It is reported that Honor's next-generation flagship model, the Honor Magic 8 series, will be released in October of this year, with the Honor Magic 8 and Honor Magic 8 Pro likely to be the first two models. Unlike the Honor Magic 7 series, which all use the Qualcomm Snapdragon 8 Extreme Edition mobile platform, the Honor Magic 8 Standard Edition may switch to the MediaTek Dimensity 9500 processor. It will also be equipped with a 1.5K OLED screen, an ultra-capacity Qinghai Lake battery, and a 50-megapixel main camera with a large bottom. In terms of price, similar to the Honor Magic 7 series, the Honor Magic 8 series is expected to have a starting price of over 4,000 yuan.
